doc. no : qw0905- rev. : date : data sheet super bright round type led lamps LUG2040-PF ligitek electronics co.,ltd. property of ligitek only - 2008 09 - mar. a LUG2040-PF-08 lead-free parts pb
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions ligitek electronics co.,ltd. property of ligitek only 25.0min -30 % 75 % 100 -60 0 % 25 % 25 % 50% 75 % 50% 100 60 0 30 2.54typ - + 1.0min 0.5 typ 1.5max LUG2040-PF part no. 1/5 page 5.2 4.2 4.0 3.0
36 viewing angle 2 1/2 (deg) min. 65 min. forward voltage @ ma(v) max. dominant wave length dnm 574 spectral halfwidth nm 20 typ. luminous intensity @20ma(mcd) 120 emitted part nomaterial lens color part no. LUG2040-PF i f forward current 25 ma power dissipation peak forward current duty 1/10@10khz reverse current @5v storage temperature typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. operating temperature -40 ~ +100 -40 ~ +85 tstg t opr pd ir i fp 65 75 ma mw a 10 absolute maximum ratings at ta=25 ratings ligitek electronics co.,ltd. property of ligitek only parameter symbol green unit page electrostatic discharge( * ) esd 2000 v * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. green diffused LUG2040-PF algainp green 2.6 1.7 20 2/5
part no. LUG2040-PF 40 50 60 2.5 1.5 1.0 0.5 0.5 1.0 fig.5 relative intensity vs. wavelength 650 550600 500 0 wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a ug chip typical electro-optical characteristics curve 60 4080 -20020020 2.5 2.0 1.5 1.0 1.1 1.0 1.2 0.9 2.0 1.0 0.5 0 6080 -2040 0.8 3.0 2.0 0 1000 100 10 1.0 30 20 10 0 0 ligitek electronics co.,ltd. property of ligitek only r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.2 relative intensity vs. forward current forward current(ma) page 3/5 f o r w a r d c u r r e n t ( m a ) fig.1 forward current vs. forward voltage forward voltage(v) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 ambient temperature( ) fig.4 relative intensity vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z @ 2 5 ambient temperature( ) fig.3 forward voltage vs. temperature
part no. LUG2040-PF note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 4/5 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max 60 seconds max
part no. LUG2040-PF description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. high temperature high humidity test solder resistance test thermal shock test low temperature storage test high temperature storage test test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) reliability test: operating life test test item mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard page 5/5
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